CPU roadmap: 2007 and beyond
Published: 19 Mar 2007
H1 2008
Socket to me
At this point, AMD should have its next-generation quad-core chips up and running, and it could even be wearing the desktop performance crown. If it's not, its next-generation motherboard socket, Socket AM3, due out in early 2008, might help it gain ground. Socket AM3 should allow AMD to catch Intel's Bearlake chipsets by adding support for 1,333MHz DDR3 memory, if not faster. From what we understand, the Socket AM3-compatible processors also will work with current Socket AM2 boards (although not vice versa), so you'll be able to extend the life of an AMD-based PC if you buy one this year.
Mobile platform advances
With the release of the new Puma platform in the first half of 2008, AMD will bring out a brand-new mobile processor design, this one code-named Griffin. A key advancement with this CPU family will be the introduction of split power planes for granular power management. Each processor core will have its own power plane, with a third plane beneath the integrated memory controller and HyperTransport link. This design lets Puma chipsets control each plane independently, distributing and conserving power based on workload. AMD promises further power savings with 'link power management', which applies the same dynamic scaling to HyperTransport link speeds.
In addition to better power management, the chip-to-chip connections in Puma will meet the HyperTransport 3.0 standard, which could result in higher clock speeds and theoretically more efficient use of memory. Other technology updates on the platform include support for the final 802.11n specification and for DirectX 10, as well as the company's Universal Video Decoder technology, which provides dedicated video processing on the chipset.
Alhough Intel remains tight-lipped about its plans after the release of Santa Rosa, observers agree that the first half — possibly even the first quarter — of 2008 is the most likely time frame for the introduction of mobile versions of Penryn, Intel's 45nm chip. Essentially a shrink of Core 2 Duo chips, Penryn includes a few enhancements; one such upgrade, SSE 4.0 instructions, will (according to Intel) improve the performance of multimedia applications. Another improvement will stem from Intel's switch to new materials for transistors, which should result in lower power consumption.
According to more than one report, Penryn will form the centerpiece of Intel's updated Centrino platform, code-named Montevina. The new platform will reportedly build upon its predecessor, incorporating a new chipset (Cantiga) with a 1,066MHz front-side bus as well as a new wireless module (Shiloh). Expected features for Montevina include Robson 2.0, which will take better advantage of Windows Vista's instant-on capabilities, and Intel Trusted Execution Technology, which protects data from malicious software.
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